{"id":11183,"date":"2025-10-12T19:17:50","date_gmt":"2025-10-12T17:17:50","guid":{"rendered":"https:\/\/oxfordwisefinance.com\/blog\/?p=11183"},"modified":"2025-10-12T19:18:01","modified_gmt":"2025-10-12T17:18:01","slug":"ai-gold-rush-uncovering-the-hidden-plays-from-chips-to-power-grids","status":"publish","type":"post","link":"https:\/\/oxfordwisefinance.com\/blog\/ai-gold-rush-uncovering-the-hidden-plays-from-chips-to-power-grids\/","title":{"rendered":"AI Gold Rush: Uncovering the Hidden Plays from Chips to Power Grids"},"content":{"rendered":"\n

Investors should prioritize companies that deliver advanced packaging<\/b> and power management solutions<\/b> tailored for AI data centers<\/b>.<\/p>\n

\n

Artificial intelligence<\/b> (AI) has evolved beyond a mere technological trend. It is fundamentally changing the way we live, work, learn, and interact, significantly reshaping our environment and lifestyle.<\/p>\n

However, the training and operation of sophisticated AI models that catalyze this transformation demand a substantial amount of compute power<\/b> and data bandwidth<\/b>. Consequently, the need for cutting-edge chips<\/b>, servers<\/a><\/b>, networking equipment<\/b>, and power systems<\/b> essential for constructing expansive data center<\/b> capacity has surged dramatically.<\/p>\n

\"Person<\/p>\n

Image source: Getty Images.<\/p>\n<\/div>\n

Nvidia<\/strong>‘s graphics processing units<\/b> (GPUs) are extensively utilized to facilitate accelerated computing<\/b> within AI data centers<\/b>. Meanwhile, Broadcom<\/strong> enhances communication among these chips with its bespoke networking<\/a><\/b> and connectivity solutions<\/b>. However, the realm of AI extends beyond semiconductors; it also relies heavily on dependable chip packaging<\/b> and power management systems<\/b> that ensure the efficient and reliable operation of these high-performance servers.<\/p>\n

Here, we will explore two noteworthy but less recognized companies that are significantly contributing to the gold rush in the realms of chips<\/b> and power grids<\/b>.<\/p>\n

Discovering Amkor Technology\u2019s Key Role in Semiconductor Packaging<\/h2>\n

Amkor Technology<\/strong>‘s (AMKR -7.87%<\/span>)<\/span> advanced packaging and testing solutions are pivotal in the semiconductor manufacturing ecosystem<\/b>. The firm ranks as the second-largest outsourced semiconductor assembly and test<\/b> (OSAT) entity worldwide. It specializes in assembling, packaging, and validating GPUs<\/b>, application-specific integrated circuits<\/b> (ASICs), and high-bandwidth memory<\/b> (HBM) chips, all of which are crucial for accelerated computing<\/b> platforms. These services guarantee the performance and reliability of AI<\/b> and high-performance computing<\/b> chips.<\/p>\n

In the second quarter of fiscal 2025, Amkor reported a 3% year-over-year increase in revenue, amounting to $1.5 billion, with earnings per share (EPS) reaching $0.22. However, the company’s gross margin stood at a modest 12%, primarily due to increased preparatory costs for upcoming product launches and challenges associated with the initial scaling of its high-volume manufacturing facility in Vietnam<\/b>. These margin pressures are, nonetheless, anticipated to be temporary.<\/p>\n

While Amkor’s financial growth may not exhibit explosive characteristics, there are numerous compelling reasons to keep a close watch on this company. The global advanced packaging market<\/b> is projected to escalate from $48.5 billion in 2023 to a striking $119.4 billion by 2032. This estimate seems conservative, especially considering the overwhelming demand for AI chips<\/b> in data centers<\/b> across the globe.<\/p>\n

Amkor is relentlessly reinforcing its position in advanced packaging technologies<\/b>. The company provides innovative packaging solutions, such as 2.5D<\/b> and High-Density Fan-Out<\/b> (HDFO), which enable the efficient integration of high-bandwidth memory<\/b> (HBM) into next-generation computing chips. Its next-generation HDFO product has already commenced high-volume production for a leading customer.<\/p>\n

The HDFO technology minimizes signal loss and facilitates high-bandwidth communication among densely integrated, AI-optimized chips<\/b>. Amkor’s advanced packaging and testing facilities in South Korea<\/b> and Taiwan<\/b> are operating at high utilization levels, and the company intends to further expand its capacity at these sites.<\/p>\n

As of the end of the second quarter, Amkor reported $2 billion in cash and a total liquidity of $3.1 billion, while its total debt stood at $1.6 billion. With a debt-to-EBITDA ratio of approximately 1.5, Amkor maintains sufficient financial flexibility to invest in future growth initiatives.<\/p>\n

Currently trading at nearly 20 times forward earnings, Amkor presents a compelling investment opportunity. Given its substantial exposure to the growing demand for AI-driven packaging<\/b> and testing solutions, the company appears to be a sound choice for investors at this time.<\/p>\n

Exploring Vertiv Holdings\u2019 Impact on AI Infrastructure<\/h2>\n

Vertiv Holdings<\/strong> (VRT 0.13%<\/span>)<\/span> has established itself as a major player in the AI infrastructure<\/b> landscape. The company delivers crucial power<\/b> and thermal management infrastructure<\/b> essential for operating AI data centers<\/b> efficiently at scale.<\/p>\n

Vertiv’s liquid-cooling franchise has significantly increased its capacity, scaling over 40 times since 2024, driven by surging demand from hyperscalers<\/b> seeking high-density server racks<\/b> that can handle larger power requirements. By effectively dissipating the intense heat generated by these high-power AI servers<\/b>, liquid-cooling systems not only enhance energy efficiency but also mitigate performance degradation caused by overheating.<\/p>\n

Vertiv’s financial results have been remarkable. The company’s net sales surged by 35% year-over-year, exceeding $2.6 billion in the second quarter. Furthermore, its backlog soared by 21%, reaching $8.5 billion. This impressive performance underscores the company\u2019s robust revenue visibility for 2025. Currently, Vertiv anticipates net sales of $10 billion and adjusted diluted earnings per share (EPS) guidance of $3.80 for this fiscal year. Additionally, management is targeting an adjusted operating margin of 20% for 2025, with aspirations to reach 25% by 2029.<\/p>\n

Moreover, the company has enhanced its capabilities for AI-driven monitoring and control of its power and cooling systems through the acquisition of Waylay NV. As a result, Vertiv is exceptionally positioned to offer fully integrated and prefabricated systems to hyperscalers<\/b>, facilitating the rapid expansion of data center capacity.<\/p>\n

Vertiv has established collaborations with CoreWeave<\/strong> and Dell Technologies<\/strong> to deploy Nvidia’s latest Blackwell architecture-based GB300 NVL72 system. Additionally, its partnership with Oklo<\/strong> is set to provide data centers access to advanced nuclear power plants. This innovative nuclear power technology can assist data centers in managing their long-term energy requirements economically. All these factors underscore Vertiv\u2019s leading role in the advancement of AI infrastructure.<\/p>\n

Looking ahead, Vertiv anticipates generating adjusted free cash flow of $1.4 billion in fiscal 2025. With $2.5 billion in liquidity and a net leverage ratio (total debt to earnings) of only 0.6x, the company possesses ample flexibility to support future growth initiatives, both organically and through acquisitions.<\/p>\n

While trading at nearly 33.4 times forward earnings, Vertiv shares carry a premium valuation. However, this premium is justified by the strong demand for its power<\/b> and thermal management solutions<\/b> in the global AI<\/b> expansion. Thus, investing in this stock could be a wise decision at present.<\/p>\n<\/p>\n<\/div>\n\n

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Vertiv is increasingly bridging the gap between power and thermal systems (often referred to as gray space<\/b>) and IT hardware and racks (known as white space<\/a><\/b>) within data centers. The recent acquisition of Great Lakes has enriched Vertiv’s portfolio, adding data rack enclosures<\/b>, custom racks, and enhanced cable management solutions. This strategic move has further solidified Vertiv’s ability to integrate white space<\/b> and gray space<\/b> effectively in data center environments.<\/p>\n